Surface treatment process for reducing electrolytic copper foil lateral erosion phenomenon

一种减少电解铜箔侧蚀现象的表面处理工艺

Abstract

A surface treatment process for reducing the electrolytic copper foil lateral erosion phenomenon includes the following steps that firstly, an electrolyte is prepared, wherein complex agents of potassium pyrophosphate, cobaltous sulfate and nickel sulfate and an additive B are mixed and then dissolved in water to acquire a settled solution, the concentration of K4P2O7 in the solution ranges from 30 g/L to 55 g/L, the concentration of Co2+ ranges from 0.7 g/L to 2.5 g/L, the concentration of Ni2+ ranges from 0.3 g/L to 1.0 g/L, the concentration of the additive B ranges from 0.5 g/L to 1.5 g/L, anodes in the additive B are at least one type of Na+, Zn2+ and Fe2+, and cathodes are at least one type of chloride ions and citric acid ions; and secondly, copper foil is electroplated, wherein the pretreated copper foil is placed in a plating bath containing the electrolyte so as to be electroplated. By the adoption of the surface treatment process, nickel sulfate is added to a cobalt plating solution, a Co-Ni binary alloy plating layer is formed, and the electrolytic copper foil lateral erosion phenomenon is reduced.
一种减少电解铜箔侧蚀现象的表面处理工艺,包括如下步骤:(1)电解液的制备:将络合剂焦磷酸钾、硫酸钴、硫酸镍和添加剂B混合后,溶于水中得到澄清溶液,且溶液中K4P2O7?浓度为30g/L~55g/L,Co2+浓度为0.7g/L~2.5g/L,Ni2+浓度为0.3g/L-1.0g/L,添加剂B浓度为0.5g/L-1.5g/L,其中添加剂B中阳离子为Na+、Zn2+和Fe2+中的至少一种,阴离子为氯离子和柠檬酸根离子中的至少一种;(2)铜箔电镀:将预处理后的铜箔放入含有步骤(1)电解液的电镀槽中进行电镀。本发明主要是在镀钴溶液中添加硫酸镍,形成Co-Ni二元合金镀层,减少了电解铜箔侧蚀现象的发生。

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (6)

    Publication numberPublication dateAssigneeTitle
    CN-101906630-ADecember 08, 2010山东金宝电子股份有限公司电解铜箔的黑色表面处理工艺
    CN-101935836-AJanuary 05, 2011山东金宝电子股份有限公司高档fr-4覆铜板用红化铜箔的表面处理工艺
    CN-102618902-AAugust 01, 2012山东金宝电子股份有限公司一种挠性覆铜板用铜箔的表面处理工艺
    JP-2002176242-AJune 21, 2002Nikko Materials Co Ltd, 株式会社日鉱マテリアルズCopper foil for electronic circuit and method for forming electronic circuit
    JP-2012219368-ANovember 12, 2012Nan Ya Plastics Corp, ナン ヤ プラスティクス コーポレーションベリーロープロファイル銅箔を担体とした極く薄い銅箔及びその製法。
    KR-100294394-B1September 17, 2001권문구, 엘지전선 주식회사인쇄회로기판용전해동박및그의제조방법

NO-Patent Citations (2)

    Title
    简志超 等: "电解铜箔镀锌镍钴合金及其性能", 《电镀与涂饰》
    陈天玉: "《镀镍合金》", 31 October 2007

Cited By (0)

    Publication numberPublication dateAssigneeTitle