Imaging unit and endoscope device



An imaging unit (40) comprises: a solid state image sensor (44) which generates an electrical signal by receiving light and performing optical-electrical conversion; a substrate (45) which extends from the solid state image sensor (44) in an optical axis direction of the solid state image sensor (44); and a laminated substrate (46) which is formed on a surface of the substrate (45), multiple electrical parts (55-58) being mounted thereon, multiple conductor layers (67-69) and multiple vias (71-76) being formed therein, at least one of the multiple electrical parts (55-58) being buried inside the laminated substrate (46), the vias (71-76) being formed outside the electrical part buried inside the laminated substrate (46) relative to an optical axis direction of the laminated substrate (46).




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Patent Citations (8)

    Publication numberPublication dateAssigneeTitle
    CN-102648840-AAugust 29, 2012富士胶片株式会社Endoscope apparatus
    CN-102727163-AOctober 17, 2012富士胶片株式会社内窥镜及其摄像装置
    CN-102802497-ANovember 28, 2012奥林巴斯医疗株式会社摄像单元
    JP-2011050497-AMarch 17, 2011Olympus Medical Systems Corp, オリンパスメディカルシステムズ株式会社Imaging device and electronic endoscope
    JP-2012186301-ASeptember 27, 2012Olympus Corp, オリンパス株式会社Wiring board, method of manufacturing wiring board, and imaging device
    US-2013008694-A1January 10, 2013Fujifilm CorporationEndoscope
    WO-2012043187-A1April 05, 2012オリンパス株式会社Photoelectric conversion connector, optical transmission module, image capturing device, and endoscope
    WO-2012120742-A1September 13, 2012オリンパス株式会社配線板、配線板の製造方法、および撮像装置

NO-Patent Citations (0)


Cited By (0)

    Publication numberPublication dateAssigneeTitle