Imaging unit and endoscope device

摄像单元和内窥镜装置

Abstract

An imaging unit (40) comprises: a solid state image sensor (44) which generates an electrical signal by receiving light and performing optical-electrical conversion; a substrate (45) which extends from the solid state image sensor (44) in an optical axis direction of the solid state image sensor (44); and a laminated substrate (46) which is formed on a surface of the substrate (45), multiple electrical parts (55-58) being mounted thereon, multiple conductor layers (67-69) and multiple vias (71-76) being formed therein, at least one of the multiple electrical parts (55-58) being buried inside the laminated substrate (46), the vias (71-76) being formed outside the electrical part buried inside the laminated substrate (46) relative to an optical axis direction of the laminated substrate (46).
摄像单元(40)具有:固体摄像元件(44),其通过接受光并进行光电转换而生成电信号;基板(45),其从固体摄像元件(44)起在固体摄像元件(44)的光轴方向上延伸;以及层叠基板(46),其作为形成于基板(45)的表面的层叠基板,安装有多个电子部件(55~58)并且在内部形成有多个导体层(67~69)和多个过孔(71~76),多个电子部件(55~58)中的至少一个埋设于层叠基板(46)的内部,过孔(71~76)在层叠基板(46)的光轴方向上形成在埋设于层叠基板(46)的内部的电子部件的外侧。

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