Hydrophobic inorganic particles, resin composition for heat dissipation member, and electronic component device

疏水性无机颗粒、散热部件用树脂组合物和电子部件装置

Abstract

本发明涉及一种疏水性无机颗粒,其是用有机化合物对无机颗粒进行表面修饰而得到的疏水性无机颗粒,其特征在于,使相对于该疏水性无机颗粒1质量份,添加200质量份的乙醇,进行10分钟超声波清洗,进行固液分离之后,干燥得到的该疏水性无机颗粒0.1g,分散在将己烷和水以体积比1:1混合得到的混合液40g中时,50质量%以上的疏水性无机颗粒转移至含有己烷的相。根据本发明,能够提供能够使树脂组合物的优异的流动性和优异的导热性兼备的疏水性无机颗粒、和含有该无机颗粒的树脂组合物。
The present invention pertains to hydrophobic inorganic particles obtained by modifying the surfaces of inorganic particles with an organic compound. After adding 200 parts by mass of ethanol to one part by mass of said hydrophobic inorganic particles, performing ultrasonic cleaning for 10 minutes, and performing solid-liquid separation, when 0.1 g of dried hydrophobic inorganic particles are dispersed in 40 g of a mixed liquid obtained by mixing hexane and water at a 1:1 volume ratio, at least 50 mass% of the hydrophobic inorganic particles transition to a hexane-containing phase. Hydrophobic inorganic particles capable of balancing excellent fluidity and excellent thermal conductivity in a resin composition, and a resin composition containing said inorganic particles, are provided by the present invention.

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