Hydrophobic inorganic particles, resin composition for heat dissipation member, and electronic component device



The present invention pertains to hydrophobic inorganic particles obtained by modifying the surfaces of inorganic particles with an organic compound. After adding 200 parts by mass of ethanol to one part by mass of said hydrophobic inorganic particles, performing ultrasonic cleaning for 10 minutes, and performing solid-liquid separation, when 0.1 g of dried hydrophobic inorganic particles are dispersed in 40 g of a mixed liquid obtained by mixing hexane and water at a 1:1 volume ratio, at least 50 mass% of the hydrophobic inorganic particles transition to a hexane-containing phase. Hydrophobic inorganic particles capable of balancing excellent fluidity and excellent thermal conductivity in a resin composition, and a resin composition containing said inorganic particles, are provided by the present invention.




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Patent Citations (8)

    Publication numberPublication dateAssigneeTitle
    CN-102250385-ANovember 23, 2011国立大学法人东北大学, 日东电工株式会社有机无机复合颗粒、颗粒分散液和颗粒分散树脂组合物
    CN-102822098-ADecember 12, 2012日东电工株式会社粒子、粒子分散液、粒子分散树脂组合物、其制造方法、树脂成形体、其制造方法、催化剂粒子、催化剂液、催化剂组合物、催化剂成形体、钛络合物、氧化钛粒子及其制造方法
    JP-2005194148-AJuly 21, 2005Tohoku Techno Arch Co Ltd, 株式会社東北テクノアーチOrganically modified fine particles
    JP-2011122030-AJune 23, 2011Sumitomo Bakelite Co Ltd, Tohoku Univ, 住友ベークライト株式会社, 国立大学法人東北大学エポキシ樹脂組成物、このエポキシ樹脂組成物が使用された半導体装置、有機修飾無機充填材、エポキシ樹脂組成物の製造方法
    JP-2012253151-ADecember 20, 2012Toyota Industries Corp, 株式会社豊田自動織機Electronic device
    US-2007003463-A1January 04, 2007Tohoku Techno Arch Co., Ltd.Organically modified fine particles
    WO-2012093602-A1July 12, 2012信越化学工業株式会社Highly transparent, thermally conductive silicone composition and cured material
    WO-2012133639-A1October 04, 2012住友ベークライト株式会社Silicone rubber curable composition, method for producing silicone rubber, silicone rubber, molded article, and tube for medical use

NO-Patent Citations (0)


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    Publication numberPublication dateAssigneeTitle